Our Range of Services

Sample Preparation

• Target preparation of microelectronic components for further investigations (CT, SAM, SEM, light microscopy)

Non-destructive Testing

• 3D computed tomography (failure analysis, investigations of components and materials, quantitative analyses such as porosity and inclusion analyses or nominal-actual value comparisons) and 2D radioscopy
• Scanning acoustic microscopy (e.g. for investigation of delamination)
• In-situ failure mode analysis of the thermal behaviour of electronic components
• Live mode in-situ thermal testing of electronic components

Destructive Testing

• Determination of physical properties via DMA
• Determination of mechanical properties via shear, pull, push and peel tests as well as 3- and 4-point bending tests
• Determination of thermal and chemical properties via DSC (reaction kinetics, specific heat capacity, melting temperature, glass transition temperature)
• Thermal impedance measurements for the determination of thermal properties (e.g. heat flow)
• Electrical characterisation of components via tip point station (sources AC/DC up to 1000 V)
• Light microscopy of electrical components