Our Equipment

  • High resolution computed tomography (Nanotom M from GE) including cooling/heating stage (-15°C to 150°C) and tension/compression/bending device
  • Scanning acoustic microscope (SAM 400 from PVA TePla) with bending device
  • Dynamic mechanical analysis (RSA G2 from TA) with a maximum force of 35 N, 3- and 4-point bending set-up including a temperature control unit (-60°C to 500°C) with a maximum heating rate of 60 K/min
  • Atomic force microscope (BRR from DME) to be used in connection with the SEM-FIB
  • Bondtester (Sigma Condor from XYZTec) with movement (x,y,z-axis) up to 50 mm/s, a resolution of 30 nm and a force range from 1 to 1000 N (± 0.075%)
  • Thermal impedance measuring system (T3Ster from Mentor Graphics) including TeraLED module and Flowtherm software
  • Tip point station from MB Technologies with AC/DC supplies up to 1000 V and parameter analyser
  • Differential scanning calorimeter (DSC 8000 from Perkin Elmer) with a calorimetric performance of ± 1300 mW (± 0.2 %) within the temperature range from -70°C to 600°C (± 0.05 °C), heating rates from 0.01°C/min to 300°C/min and cooling rates from 0.01°C/min to 150°C/min
  • Optical film thickness measuring device (F40 from Filmetrics) used in combination with a light microscope (Axio Scope from Zeiss) for measurements of transparent thin films
  • FT-IR spectrometer (Avatar 320 from Nicolett)
  • Target preparation unit (EM TXP from Leica)
  • Precision cut-off machine (Secotom-10 from Struers)
  • Polishing unit (LaboPol-25 from Struers)