We characterise the mechanical properties of different materials used for the manufacturing of microelectronic components as well as simple and complex components.

Our main focus/competences

• Determination of interfacial resistances on different materials via shear tests, peel tests, double-cantilever beam tests

• Reliability tests (creep tests, cyclic loading)

• Characterisation of wire bonds (pull tests of wires with a thickness from 20 up to 400 µm, shear tests, etc.)

• 3-point and 4-point bending tests up to 1000 N for different materials (wafers, PCBs, etc.)