The new trends towards miniaturisation and integration of functional components into printed circuit boards are a challenge for microelectronic companies competing in the market. Profound knowledge of the embedding process provides the design parameters and rules for the production of more reliable boards.
The embedding of components (e.g. ceramic capacitors, silicon semiconductors) into the inner parts of the PCB saves space on the surface and also reduces the necessary length of interconnections. This new approach can be used to increase the functionality of the system and thus convert it into a high-tech system. The integration of components plays an important role in the ongoing trend of miniaturising electronic devices.
The description of the embedding process (deformations and stresses during hot pressing of the components and cool down of the board) provides the manufacturer with design parameters and rules for the production of more reliable boards (i.e. where all components survive the embedding process). The focus of the project was on developing a Finite Element model to describe the embedding process and on determining the strength of the miniaturised components used.
The scientific achievement has been to clarify the damage mechanisms which can lead to failure of miniaturised brittle components during embedding. This was achieved by combining FE modeling and micro-analytical techniques (i.e. focused ion beam, SEM). Another challenge was the development of testing methods to determine the mechanical properties of the embedding components on a length scale of only a few millimeters. From the technological viewpoint the generation of a parametric 2D FE model to describe the deformation and stresses in the board during embedding (i.e. pressing and cooling down) has helped the company partners (especially AT&S) in establishing the ECP technology. This new embedding technology has enormous potential for use in microelectronic systems where integration and miniaturisation can add considerable value to the end product.
The project was carried out in close cooperation with the companies AT&S (Leoben-Hinterberg) and THALES (Paris, France) as well as the Institut für Struktur- und Funktionskeramik of the University of Leoben.